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  Datasheet File OCR Text:
 Product Guide
1101W Series Standard Type Flat Lens SMT LED
s Features
* Flat lens type with a wide viewing angle of 150 * Excellent for backlighting LCDs and indicators
s Applications
* Computer / Telecommunications * Industrial / Medical * Audio visual equipment
s Outline Dimensions
Unit: mm Tolerances + 0.2
s Electro-Optical Characteristics
Type No. Material Emitted Color
GaAIAs GaAsP GaAsP GaP GaP GaP
Red Orange Yellow Yellow Green Green Pure Green
(Ta=25C) Wavelength
IF Peak p TYP. Spectral Line Dominant Half Width d TYP. TYP. IF
Lens Color
Luminous Intensity IV
MIN. TYP.
Forward Voltage VF
TYP MAX. IF
Reverse Viewing Current IR Angle
MAX. VR
(2 1/2)
BR1101W AA1101W AY1101W PY1101W PG1101W BG1101W
4.4 2.8
Water Clear
12.8 20 660 5.6 4.0 8.0 4.8 2.0 20 605 20 580 20 570 20 560 20 555 mA
647 606 590 572 567 558 nm
30 30 30 30 30 30
20 20 20 20 20 20 mA
1.7 2.0 2.2 2.5 2.2 2.5 2.1 2.5 2.1 2.5 2.1 2.5 V
20 20 20 20 20 20 mA
100 100 100 100 100 100 A
4 4 4 4 4 4 V Deg. 150
2.0 4.0 2.4 0.7
Units
mcd
s Absolute Maximum Ratings
Red Orange AA 75 30 70 4 Yellow AY 75 30 70 4 -30 to +85 -40 to +100 0.42 (DC) 0.93 (Pulse)
(Ta=25C) Yellow Green PY 75 30 70 4 Green PG 75 30 70 4 Pure Green BG 75 30 70 4 mW mA mA V C C mA/C
Item Symbol
Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg IF BR 60 30 70 4
Units
* Ta=25C, IFM applies for the pulse width 1msec. and duty cycle 1/20.
s Taping Specifications
4+0.1 1.5 +0.1 0 (1.8) 1.75 + 0.1
s Operation Current Derating Chart (DC)
(0.2)
Quantity on tape: 2,500 pieces per reel
(1.7)
2+0.5 21+0.8
8+0.2
( 1.1)
2+0.05 4+0.1
BR, AA, AY, PY, PG, BG
Center Hole
3.5 + 0.05
Direction to pull
13+0.2 +1 60 -0 13+0.2
(3.35)
9+0.3 11.4+1
+0 180 3
s Precautions
Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: * Soldering iron: Temperature at tip of iron: 280C max. (30W max.) Soldering time: 3 sec. max. * Dip soldering: Preheating: 120 ~ 150C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260C max. Dipping Time: 5 sec. max. * Reflow Soldering:
LED Surface Temperature C Operation Heating 240 Temperature rise: 5C/sec. Cooling: --5C/sec.
s Spatial Distribution
150 120
Pre-heating
2. Cleaning: * If cleaning is required, use the following solutions for less than 1 minute, at less than 40C. * Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. * Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1101W-0301
~
0
60 to 120 sec.
5 sec. max
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 * Tel: 800-LED-LCD1 (533-5231) * Fax: 949-222-0555 Website: www.stanley-electric.com


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